The USB 3.0 specification defined a new architecture and protocol, named SuperSpeed, which included a new lane for a new signal coding scheme (8b/10b symbols, 5 Gbps also known later as Gen 1) providing full-duplex data transfers that physically required five additional wires and pins, while preserving the USB 2.0-architecture and -protocols and therefore keeping the original 4 pins/wires for the USB 2.0 backward-compatibility resulting in 9 wires (with 9 or 10 pins at connector interfaces ID-pin is not wired) in total. USB 3.0, released in November 2008, is the third major version of the Universal Serial Bus (USB) standard for interfacing computers and electronic devices. USB 3.0 Promoter Group ( Hewlett-Packard, Intel, Microsoft, NEC, ST-Ericsson, and Texas Instruments)
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